TDS / SDS

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  泰格士® UVA0258 TDS Tacusil UVA0258 is a low viscosity, optical clear UV glue that bonds well to engineered plastics and metal substrates. This product don’t contain no-reactive solvent and fast cure upon exposure to UV light.
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  泰格士® UVA0258 SDS 泰格士® UVA0258 SDS
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  泰格士® UVA0243SF TDS Tacusil UVA0243SF is Polyurethane modified acrylic resin UV glue. It’s medium viscosity with thixotropy and for general purpose application. It bonds well to engineered plastics, En-plating metal substrates and stainless steel. This product doesn’t contain no-reactive solvent and fast cure upon exposure to UV light.
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  泰格士® UVA0243SF SDS 泰格士® UVA0243SF SDS
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  泰格士® UVA0243LV TDS Tacusil UVA0243LV is acrylic base resin paste with thixotropy, general purpose UV glue. It bonds well to engineered plastics, En-plating metal substrates and stainless steel. This product don’t contain no-reactive solvent and fast cure upon exposure to UV light.
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  泰格士® UVA0243FS TDS Tacusil UVA0243FS is Polyurethane modified acrylic resin UV glue. It’s medium viscosity with thixotropy and for general purpose application. It bonds well to engineered plastics, En-plating metal substrates and stainless steel. This product doesn’t contain no-reactive solvent and fast cure upon exposure to UV light.
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  泰格士® UVA0243 TDS Tacusil UVA0243is acrylic base resin paste with thixotropy, general purpose UV glue. It bonds well to engineered plastics, En-plating metal substrates and stainless steel. This product doesn’t contain no-reactive solvent and fast cure upon exposure to UV light.
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  泰格士® UVA0243 SDS 泰格士® UVA0243 SDS
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  泰格士® UVA0243 Gel TDS Tacusil UVA0243-Gel is acrylic base resin paste with thixotropy, general purpose UV glue. It bonds well to engineered plastics, En-plating metal substrates and stainless steel. This product don’t contain no-reactive solvent and fast cure upon exposure to UV light.
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  泰格士® UVA0240 GEL TDS Tacusil UVA0240Gel adhesive cationic epoxy base dual-cure UV glue with thixotropy, which is designed for the application requiring low shrinkage and CTE. It contains special silica filler and has good adhesive to PBT, LCP and fiber glass. Heat secondary cure mechanism is for adhesive in shadow area and high thickness application, and it can also cure this adhesive even without UV curing process. Heat secondary cure can also reduce adhesive inner stress in UV curing process.