泰格士® EPA3065 TDS
Tacusil EPA 3065 is one-part heat cure 100% solids epoxy adhesive. It’s high viscosity with thixotrophy and long work time under room temperature and designed for bonding application with high temperature resistance special for electronic component potting and bonding.
泰格士® EPA2701T - TDS
Tacusil EPA 2701T is a two-parts medium viscosity, high temperature epoxy designed for fiber optic, structure bonding. It’s very purity epoxy offered high strength, low CTE and fast cure properties under elevated temperature. It also has excellent weather resistance, chemical resistance and good adhesin to versatile substrate.